BÜFA®-Tec BPU Theta11

The Theta11 Bonding Paste Unit offers all the advantages of this series for daily bonding of components. Ideal for large components where reproducible component qualities and efficient use of bonding paste is required.

Facts:

• Large pump unit
• Guaranteed high output with smooth, wear resistant pump operation
• The bonding paste can be taken directly from the drum
• Follower plate that reduces leftovers
• Peroxide pump with spindle mechanism and infinitely variable adjustment of the peroxide content
• Less solvent consumption

Accessories:

028-0951 Peroxide flow sensor, electronicnt

Excellent results are achieved when working with the following BÜFA bonding pastes for high strength bonding as well as structural bonding:

The recommendations presented above are a few of the possibilities for using bonding pastes. For more detailed information, please get in touch with our Technical Service Department. We’ll be glad to help.

Abbreviations for base resins:

VE – vinyl ester, OP – orthophthalic acid, IP – isophthalic acid, THP – tetrahydrophthalic acid, NPG – neopentyl glycol, BPA – bisphenol A
( ? ) = Please get in touch with our Technical Service Department.